1.Precaution
1.2.SafetyPrecautions
1)EMI
ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.
2)CircuitTest(LogicTest)Precautions
TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since
thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.
Thereforereadandfollowtheinstructionsbelow.
a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In
addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.
b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.
c)Youmustuseasolderingironwithoutaleakagecurrent.
d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.
e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong
direction,itmightbecomedamaged.
f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto
keepthevoltagelevelofeachoftheterminalsthesame.
g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.
j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.
k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.
1-2Copyright©1995-2012SAMSUNG.Allrightsreserved.
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