Samsung NP-X1 User Manual Page 349

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150 ¤ÙèÁ×ͼÙéãªé
μÑÇÂèÍμèÒ§æ
A. . . . . . . . . . . . . .áÍÁá»Ãì
AC . . . . . . . . . . . .ä¿¿éÒ¡ÃÐáÊÊÅѺ
ACPI. . . . . . . . . . .Advanced Configuration and Power management Interface
APM. . . . . . . . . . .Advanced Power Management
ATA . . . . . . . . . . .AT attachment (ÍéÒ§¶Ö§ÍÔ¹àμÍÃìà¿«¢Í§ÎÒÃì´´ÔÊ¡ìã¹à¤Ã×èͧ¤ÍÁ¾ÔÇàμÍÃìẺ AT-compatible)
ATAPI . . . . . . . . .AT attachment packet interface
BBS . . . . . . . . . . .Bulletin board system
BIOS. . . . . . . . . . .Basic input/output system
C. . . . . . . . . . . . . .à«Åà«ÕÂÊ
CD . . . . . . . . . . . .Compact disc
CD-ROM . . . . . . .Compact disc read-only memory
cm. . . . . . . . . . . . .ૹμÔàÁμÃ
COM. . . . . . . . . . .Communication (ã¹¾ÍÃìμÊ×èÍÊÒÃ)
CMOS. . . . . . . . . .Complementary metal-oxide semiconductor
DC . . . . . . . . . . . .ä¿¿éÒ¡ÃÐáÊμç
DMA. . . . . . . . . . .Direct memory access
DPMS. . . . . . . . . .Display power-management signaling
DRAM . . . . . . . . .Dynamic random access memory
DSTN . . . . . . . . . .Double layer super twist nematic
ECP . . . . . . . . . . .Extended capabilities port
EPP . . . . . . . . . . .Enhanced parallel port
g . . . . . . . . . . . . . .¡ÃÑÁ
G . . . . . . . . . . . . .áçâ¹éÁ¶èǧ
GB . . . . . . . . . . . .¡Ô¡Ðäºμì
hr . . . . . . . . . . . . .ªÑèÇâÁ§
Hz. . . . . . . . . . . . .àÎÔÃìμ«ì
IDE. . . . . . . . . . . .Integrated drive electronics
I/O . . . . . . . . . . . .Input/output
IRQ . . . . . . . . . . .Interrupt request line
ISA . . . . . . . . . . . .Industry Standard Architecture
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