Samsung YP-P10 User Manual Page 589

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ELECTRICAL DATA S3C2440A RISC MICROPROCESSOR
27-36
Table 27-8. ROM/SRAM Bus Timing Constants
(V
DDi,
V
DDalive,
V
DDiarm
= 1.2 V ± 0.1 V, T
A
= –40 to 85 °C, V
DDMOP
= 3.3V ± 0.3V / 3.0V ± 0.3V / 2.5V ± 0.2V / 1.8V
± 0.1V)
Parameter Symbol Min
(V
DDMOP
=
3.3V/3.0V/2.5V/1.8V)
Typ Max
(V
DDMOP
=
3.3V/3.0V/2.5V/1.8V)
Unit
ROM/SRAM address delay t
RAD
2 / 2 / 2 / 3 6 / 6 / 7 / 8 ns
ROM/SRAM chip select delay t
RCD
2 / 2 / 3 / 3 6 / 6 / 6 / 7 ns
ROM/SRAM output enable delay t
ROD
2 / 2 / 2 / 3 5 / 5 / 5 / 6 ns
ROM/SRAM read data setup time. t
RDS
1 / 1 / 1 / 2 – / – / – / – ns
ROM/SRAM read data hold time. t
RDH
0 / 0 / 0 / 0 – / – / – / – ns
ROM/SRAM byte enable delay t
RBED
2 / 2 / 2 / 3 5 / 5 / 5 / 7 ns
ROM/SRAM write byte enable delay t
RWBED
2 / 2 / 2 / 3 5 / 5 / 6 / 7 ns
ROM/SRAM output data delay t
RDD
2 / 2 / 2 / 2 6 / 6 / 6 / 7 ns
ROM/SRAM external wait setup time t
WS
3 / 3 / 4 / 4 – / – / – / – ns
ROM/SRAM external wait hold time t
WH
0 / 0 / 0 / 0 – / – / – / – ns
ROM/SRAM write enable delay t
RWD
2 / 2 / 2 / 3 5 / 5 / 6 / 7 ns
Table 27-9. Memory Interface Timing Constants
(V
DDi,
V
DDalive,
V
DDiarm
= 1.2 V ± 0.1 V, T
A
= –40 to 85 °C, V
DDMOP
= 3.3V ± 0.3V / 3.0V ± 0.3V / 2.5V ± 0.2V / 1.8V
± 0.1V)
Parameter Symbol Min Typ Max Unit
SDRAM address delay t
SAD
1 4 ns
SDRAM chip select delay t
SCSD
1 3 ns
SDRAM row active delay t
SRD
1 3 ns
SDRAM column active delay t
SCD
1 3 ns
SDRAM byte enable delay t
SBED
1 3 ns
SDRAM write enable delay t
SWD
1 2 ns
SDRAM read data setup time t
SDS
2 / 3 / 3 / 5 * ns
SDRAM read data hold time t
SDH
0 ns
SDRAM output data delay t
SDD
1 4 ns
SDRAM clock enable delay T
cked
2 3 ns
NOTE: Minimum t
SDS
= 2ns / 3ns / 3ns, when V
DDMOP
= 3.3V / 3.0V / 2.5V / 1.8V respectively.
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